GUIDE TO CHOOSING THE RIGHT OPTOELECTRONIC HYBRID

Do optoelectronic products include optical fibers and cables

Do optoelectronic products include optical fibers and cables

Optoelectronics combines light and electricity to power devices from fiber optic cables to medical sensors. Every LED in your home, the camera sensor in your phone, the laser reading a fiber optic cable, and the pulse oximeter clipped to your finger all rely on optoelectronic. 2 OEMs are integral to these technologies, as they harness the interaction between light and electricity.

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50kW Optoelectronic Fusion for Oil Pipeline Monitoring

50kW Optoelectronic Fusion for Oil Pipeline Monitoring

In this paper, we propose an integrated infrared and visual detection system and corresponding fusion detection algorithm. FOPipe is FEBUS Optics' comprehensive and easy to implement solution for ensuring continuous real-time monitoring of pipeline integrity, whether onshore or offshore. OptaSense raises the bar by delivering a single system that detects smaller pipeline leaks faster and more reliably, while simultaneously monitoring for third-party interference and other external pipeline threats in order to prevent leaks altogether.

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Optoelectronic Fusion Bonding Technology

Optoelectronic Fusion Bonding Technology

Fusion or direct wafer bonding enables permanent connection via dielectric layers on each wafer surface used for engineered substrate or layer transfer such as backside illuminated CMOS image sensors. EVG's HI Competence Center is designed to help enable new products and applications driven by advances in system integration and packaging. Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing for face-to-face connection of wafers. Focusing on photonic integrated circuits (PICs), which are based on SOI fabrication infrastructure, heterogeneous integration of III-V materials, such as indium phosphide (InP), enables high performance devices at low cost and high volumes. Fusion bonding plays a pivotal role in enabling CFET and BSPDN structures in logic devices, as well as advanced 3D memory structures.

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Drilling holes on the side of the cable tray

Drilling holes on the side of the cable tray

To avoid transverse bending at higher loads, a joint plate must be used for tray widths of 400 mm or more in the joint area of the cable trays that are to be connected. Developed by Interstates, this cable tray cutting guide acts as a guide for a metal cutting circular saw for cutting the side rail of a cable tray as well as a guide for drilling the connecting holes in the cable tray. A rung spacing of 6 to 9 inches (150 to 230 mm) is preferable when the cable tray cont d for instrumentation and control applications that require. The most common method of locating the hole positions is to use a splice plate as a template.

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