Linz, 11 December 2025 – HPW Metallwerk GmbH (HPW), a manufacturer of high-performance copper wires for industrial applications, has established a joint venture with BRAND KG (brandgroup) for the joint production of innovative busbars. The joint venture, operating under the name High Performance Busbars, offers the. By uniting efforts, the companies aim to strengthen their market presence, notably in China and Mexico.
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Continuous, real-time busbar temperature monitoring and hot spot detection for MV & HV switchgear, substations and power plants — EMI-immune, calibration-free, fully SCADA-integrated. complex data into clear insights for action, reducing noise and speeding response. Wireless temperature measurement system, specially built for high voltage electrical contact temperature monitoring. Switchgear and busbars can be constantly and comprehensively monitored for temperature rises without a complicated setup. Our solution provides reliable and intelligent alarming to the facility manager well before any possible disruptive incidents occur.
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The objective of this work is to compare different laminated aluminum busbars expansion joints in terms of their capacity to accept imposed displacements as well as fabrication and installation costs.
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The NEC requires a minimum spacing of 12 inches (305 mm) between busbars, but this can be reduced based on the busbar current and configuration. The IEC standard for busbar clearance plays a critical role in the design and safety of electrical panels and power distribution systems. And for general industrial control equipment, voltage range 301-600, shortest distance is shown as 1/2" with this same value being shown through oil or air over surface. Between live parts of opposite polarity, 251-600V, Through air gap is 1", Over surface is 2". Guide to Low Voltage Busbar Trunking Systems Verified to BS EN 61439-6 Guide to Low Voltage Busbar Trunking Systems Verified to BS EN 61439-6 November 2014 Guide to Low Voltage Busbar Trunking Systems Verified to BS EN 61439-6 Companies involved in the preparation of this Guide Acknowledgements. If you can place bare conductors 1/2" apart and meet the test requirements for 15kV equipment, that is fine. And before you conclude that I'm being ridiculous, remember that we do this every day in vacuum interrupters.
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A cold solder joint forms when solder does not melt or wet the pad and component lead completely. Instead of creating a unified bond, the solder cools prematurely or never flows correctly, resulting in a dull, grainy, or uneven connection. They often look harmless, but can cause intermittent failures, unexpected resistance spikes, and field returns long after a product has passed initial testing. While these joints may look acceptable at first glance, they can become problematic over time, especially when exposed to vibration, thermal. This is the most common type of defect especially found under POP packages, where two or more Chip Scale Packages (CSP) or Ball Grid Array (BGA) components are placed one on top of the other and reflow soldered.
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